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[Introduction to Cutting/Processing Methods] Slicer Cutting Processing

Cutting accuracy is ±0.01mm! We can also handle strip cutting, individual piece cutting, deep groove processing, and wide groove cutting.

Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, it can be processed with high precision. "Slicer cutting processing" involves adhering with WAX suitable for the product and processing conditions, allowing for strip cutting, individual piece cutting, deep groove processing, and wide groove cutting according to patterns and product edges. The main processing materials include alumina, aluminum nitride, piezoelectric ceramics, and glass materials. 【Work Size】 ■ Maximum: 250×160×15.0mm ■ Minimum cutting dimension: 0.5mm ■ Deep groove specification slicer: t40.0mm, capable of groove depth up to 35.0mm ■ Cutting precision: ±0.01mm~ *For more details, please refer to the PDF document or feel free to contact us.

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